LED-based light source utilizing asymmetric conductors

ABSTRACT

A light source includes LED dies that are flip-chip mounted on a flexible plastic substrate. The LED dies are attached to the substrate using an asymmetric conductor material with deformable conducting particles sandwiched between surface mount contacts on the LED dies and traces on the substrate. A diffusively reflective material containing light scattering particles is used instead of expensive reflective cups to reflect light upwards that is emitted sideways from the LED dies. The diffusively reflective material is dispensed over the top surface of the substrate and contacts the side surfaces of the dies. The light scattering particles are spheres of titanium dioxide suspended in silicone. The light source is manufactured in a reel-to-reel process in which the asymmetric conductor material and the diffusively reflective material are cured simultaneously. A silicone layer of molded lenses including phosphor particles is also added over the mounted LED dies in the reel-to-reel process.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of, and claims priority under 35U.S.C. § 120 from, nonprovisional U.S. patent application Ser. No.13/086,310 entitled “LED-Based Light Source Utilizing AsymmetricConductors,” filed on Apr. 13, 2011, now U.S. Pat. No. 9,478,719, whichin turn is a continuation-in-part of, and claims priority under 35U.S.C. § 120 from, nonprovisional U.S. patent application Ser. No.12/941,799, entitled “LED-Based Light Source Utilizing AsymmetricConductors,” by Yan Chai and Calvin B. Ward, filed on Nov. 8, 2010, nowU.S. Pat. No. 8,455,895. The subject matter of each of theaforementioned patent documents is incorporated herein by reference.

TECHNICAL FIELD

The present invention relates generally to packaging for light-emittingdiodes, and more particularly, to a low-cost method of making an LEDlight source with improved light extraction characteristics.

BACKGROUND INFORMATION

Light emitting diodes (LEDs) are an important class of solid-statedevices that convert electric energy into light. Improvements in thesedevices have resulted in their use in lighting fixtures as replacementsfor conventional incandescent and fluorescent light sources. LEDs havesignificantly longer lifetimes than both incandescent bulbs andfluorescent tubes. In addition, the energy conversion efficiency of LEDshas now reached the same level as that obtained in fluorescent lightfixtures and promises to exceed even these efficiencies.

A single LED produces too little light to be used as a replacement for aconventional lighting source in most applications. Hence, a replacementlight source must utilize a large number of individual LEDs. Thepackaging costs and reliability problems that result from having to uselarge numbers of individual LEDs present challenges that must beovercome if LED-based light sources are to reach their full potential asreplacements for conventional light sources.

FIG. 1 (prior art) is a cross-sectional view of a portion of a priorart, phosphor-converted, LED light source. Light source 20 includes aplurality of LEDs of which LED 21 is typical. The LEDs are mounted on aprinted circuit board 32 that includes a heat-spreading layer 33, aninsulating layer 34, and a conducting layer that is patterned to provideelectrical conductors such as conductor 35. The LEDs are mounted indepressions having reflecting walls 36 that re-direct light leaving theside surfaces of the LEDs such that the light leaves the light source inthe vertical direction as shown by the arrows. The surface ofheat-spreading layer 33 is typically covered with a reflecting materialthat redirects any light that is emitted in a downward direction intothe upward direction. The LEDs are covered by a layer of phosphor 37that converts a portion of the blue light generated by the LEDs to lightin the yellow region of the optical spectrum. The combination of theblue and yellow light is perceived as “white” light by a human observer.

The LEDs include a light-emitting structure 22 that is deposited on asapphire substrate 23. The light-emitting structure can be viewed as anactive layer 24 that is sandwiched between an n-type GaN layer 28 thatis deposited on substrate 23 and a p-type GaN layer 25 that is depositedover the active layer. The device is powered from contacts 26 and 27.Since p-type GaN has a very high resistivity, a current spreading layer29 is typically deposited on the surface of layer 25. In the arrangementshown in FIG. 1, light is extracted through the top surface of the LED,and hence, the current spreading layer must be transparent. Typically,indium tin oxide (ITO) is used for the current spreading layer.

The electrical connections to the LEDs are provided by wire bonds, suchas bond 31, that connect the contacts on the LEDs to correspondingcontacts on a printed circuit board. The wire bonds present problems interms of fabrication cost and reliability, particularly when the lightsource includes a large number of individual dies. The wire bonds aresubject to failure both at the time of initial implementation of thebonds and later due to stresses between the phosphor layer and theencapsulated wire bonds. In addition, the wire bonds block a significantfraction of the light leaving the LEDs, as both the bond pads and thegold wire absorb light.

The arrangement shown in FIG. 1 provides good light capture with respectto the light leaving the sides of the LEDs. However, this aspectrequires a more complex mounting substrate having reflective cups. Thecost of the substrate increases the cost of the light source.

The arrangement shown in FIG. 1 has the advantage of providing good heatconduction because the entire bottom surface of the LEDs is in contactwith the heat-spreading layer 33 of the printed circuit board. Heatremoval is an important aspect of high-powered LED light sources, as theefficiency of the LEDs decreases with temperature. In addition,mechanical problems that arise from differences in the thermalcoefficient of expansion between phosphor layer 37 and printed circuitboard 32 become worse as the operating temperature increases.

The problems associated with wire bonds can be reduced by utilizing aflip-chip mounting scheme. FIG. 2 (prior art) is a cross-sectional viewof a portion of another prior art light source that utilizes a flip-chipmounting scheme. Light source 40 includes a plurality of surface mountedLEDs. For the purposes of this discussion, a surface mounted LED isdefined to be an LED in which both the p-contact and the n-contact areon one side of the LED, light being emitted primarily through anopposing surface of the LED, although some of the light may be emittedthrough the side surfaces of the LED. In the case shown in FIG. 2, thesapphire substrate 41 faces upward and the LEDs are connected to themounting substrate by the contacts that are used to power the LEDs.Light is emitted through the sapphire substrate. The p-contact includesa mirror 42 that re-directs light striking the contact such that thelight exits through the sapphire substrate or side surfaces of the LED.The mirror can also act as the current spreading layer thereby reducingor eliminating the need to use an ITO layer. While the ITO layer is notneeded for current spreading in this arrangement, the ITO layer canstill provide an ohmic contact with the p-GaN layer, and hence, a thinITO layer may be included in the p-contact. Since light does not exitthrough the p-GaN layer, the p-contact can extend substantially over theentire active layer, and hence the problems of providing currentspreading over the highly resistive p-GaN layer are substantiallyreduced. For the purposes of this discussion, the p-contact will bedefined to extend over substantially all of the active layer if thep-contact overlies at least 60 percent of the active layer.

The n-contact and p-contact are bonded to corresponding traces 43 and44, respectively, on the mounting substrate. These traces are patternedon an insulating layer 45 that overlies the heat-dissipating core region46 of the printed circuit board. Suitable bonding materials that utilizesolder, thermal compression bonding, or asymmetric conducting adhesivesare known to the art. Novel asymmetric adhesives will be discussed inmore detail below.

While the arrangement shown in FIG. 2 reduces the problems associatedwith the wire bonds, heat dissipation and the loss of light that exitsthrough the sidewalls of the LEDs remains problematic. If the LEDs aremounted in reflective cups as described above, the cost of the substratebecomes a problem. Furthermore, the bonding process requires that theLEDs be pressed against the printed circuit board during the bondingprocess, and hence providing a pressure mechanism that can operate onall of the LEDs in a light source at once is problematic if the LEDs arein reflective cups.

An LED packaging arrangement is sought that allows light leaving thesides of flip-chip mounted LEDs to be emitted upwards without usingreflective cups.

SUMMARY

The present invention includes a light source and method for making thesame. The light source includes a plurality of surface mount LEDs thatare bonded to a mounting substrate by a layer of asymmetric conductor.Each LED has surface mount contacts on a first surface thereof and emitslight from a second surface thereof that is opposite the first surface.The surface mount contacts include a p-contact and an n-contact forpowering that LED. Each LED is characterized by an active layer thatgenerates light of a predetermined wavelength, the p-contact having anarea that is greater than or equal to at least half of the active regionin the LED. The mounting substrate includes a top surface having aplurality of connection traces. Each connection trace includes ann-trace positioned to underlie a corresponding one of the n-contacts anda p-trace positioned to underlie a corresponding one of the p-contacts,the p-trace having an area greater than the p-contact. The layer ofasymmetric conductor is sandwiched between the surface mount contactsand the connection traces.

In one aspect of the invention, the LEDs are spaced apart from oneanother and the LEDs emit light from side surfaces of the LEDs. Theasymmetric conductor is present in spaces between the LEDs to a heightsuch that light leaving the side surfaces of the LEDs enters theasymmetric conductor located between the LEDs. The asymmetric conductorincludes scattering particles that scatter the light leaving the sidesurfaces.

In another aspect of the invention, a light source includes LED diesthat are flip-chip mounted onto a flexible plastic substrate. Theflexible substrate is used in a reel-to-reel process to make a striplight source. The dies are attached to the substrate using an asymmetricconductor material (ACF material) in which deformable conductingparticles are sandwiched between surface mount contacts on the LED diesand connection traces on the flexible substrate. A diffusivelyreflective material reflects light that is emitted sideways from the LEDdies upwards towards a phosphor layer. The diffusively reflectivematerial is disposed on the top surface of the substrate and contactsthe side surfaces of the LED dies. In one embodiment, the diffusivelyreflective material includes spheres of titanium dioxide suspended insilicone. The light source is manufactured in a reel-to-reel process inwhich the asymmetric conductor material and the diffusively reflectivematerial are cured at the same time. A silicone layer of molded lensesthat has either suspended phosphor particles or a layer of phosphor isalso added in the reel-to-reel process over the mounted LED dies.

The light scattering particles in the reflective material adjacent tothe LED dies provide a means for reflecting light that is emitted fromthe side surface of the LED dies away from the substrate without placingeach LED die in an expensive reflective cup.

A method of manufacturing a light source uses a reel-to-reel process todeposit an amount of asymmetric conductor material on a mountingsubstrate, such as a flexible plastic substrate. The asymmetricconductor material includes deformable conducting particles suspended ina transparent carrier material, such as epoxy or silicone. An LED die ismounted onto the substrate in a flip-chip manner over the depositedamount of asymmetric conductor material. Then a diffusively reflectivematerial is dispensed onto the substrate adjacent to the mounted LED diesuch that the diffusively reflective material contacts the LED die. Thediffusively reflective material includes light scattering particlessuspended in the transparent carrier material. The LED die is thenpressed against the substrate such that some of the deformableconducting particles deform and form an electrical connection betweencontacts on the LED die and traces on the substrate. The transparentcarrier material is then heated such that both the asymmetric conductormaterial and the diffusively reflective material cure to a hardenedstate. A layer of cured transparent carrier material with suspendedphosphor particles is then deposited over the LED die and thediffusively reflective material. The layer of cured transparent carriermaterial includes molded lenses.

Further details and embodiments and techniques are described in thedetailed description below. This summary does not purport to define theinvention. The invention is defined by the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, where like numerals indicate like components,illustrate embodiments of the invention.

FIG. 1 (prior art) is a cross-sectional view of a portion of a priorart, phosphor-converted, LED light source.

FIG. 2 (prior art) is a cross-sectional view of a portion of anotherprior art light source.

FIG. 3 is a cross-sectional view of a pair of surfaces that are bondedby an asymmetric conductor.

FIG. 4 is a cross-sectional view of a portion of a light sourceaccording to one embodiment of the present invention.

FIG. 5 is a top view of a portion of a mounting substrate before theLEDs have been bonded to the n-traces and p-traces.

FIG. 6 is a cross-sectional view of a portion of another embodiment of alight source according to the present invention.

FIGS. 7-9 are cross-sectional views of a portion of a light sourceaccording to one embodiment of the present invention at various stagesin the fabrication process.

FIG. 10 is a cross-sectional view of another embodiment of a lightsource that has a diffusively reflective material deposited above alayer of asymmetric conductor material.

FIG. 11 is a cross-sectional view of yet another embodiment of a lightsource that has a diffusively reflective material deposited on aflexible plastic substrate.

FIG. 12 is a flowchart of steps for making a strip light source byflip-chip mounting LED dies separated by diffusively reflectivematerial.

FIG. 13 illustrates a reel-to-reel process for making the strip lightsource of FIG. 11.

FIGS. 14A-F are cross-sectional views of the light source of FIG. 11 atvarious stages of the manufacturing method of FIG. 12.

FIGS. 15A-D are flowcharts illustrating methods in addition to themethod of FIG. 12 for making light sources that use diffusivelyreflective material instead of reflective cups to reflect light that isemitted sideways from the LED dies.

FIG. 16 is a cross-sectional view of the light source of FIG. 11 with alens having a conventional shape.

FIG. 17A is a cross-sectional view of the light source of FIG. 11 with alens having a novel shape that improves the light extractioncharacteristics of the light source.

FIG. 17B shows examples of micro-structures on the surface of the novellens of FIG. 17A.

FIG. 18 is a perspective view of the strip light source of FIG. 17A withthe novel dimple-shaped lenses.

DETAILED DESCRIPTION

Reference will now be made in detail to some embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings.

A novel LED packaging arrangement allows light leaving the sides offlip-chip mounted LEDs to be emitted upwards without using reflectivecups by making the surface of the mounting substrate between the LEDsreflective and by filling the regions betweens the LEDs with atransparent material that includes scattering particles. The lightleaving the sides of the LEDs is scattered until it either leaves thelight source in a generally upward direction or is absorbed aftermultiple reflections. While re-direction of light by scattering is lessefficient than embodiments that utilize cups or other reflectors, thereduced cost of fabrication often is more important, as additional LEDscan be added to the array to make up for light losses. While this modeof light re-direction does not require reflective cups, the process doesrequire a separate deposition step in which scattering material isintroduced between the LEDs. If the LEDs are in a closely packed array,this injection of material between the LEDs presents challenges.

Heat dissipation requires a low thermal resistance path from the LED tothe underlying core region and a low thermal resistance path from coreregion to the structure that finally transfers the heat to theenvironment, typically at an air interface. If either of these pathspresents a large thermal resistance, the LEDs will be forced to operateat elevated temperatures to drive the heat along the resistive path.Typically, GaN LEDs are designed to operate at temperatures below 100°C. or 75° C. above ambient. In one aspect of the invention, the thermalpaths from the LEDs to the final heat-radiating structure that transfersthe heat to the environment are dimensioned such that the heat generatedin the LEDs can be transferred to the environment without requiring theLEDs to be operated at a temperature that is greater than 75° C. abovethe temperature of the environment in question.

The path from the LEDs to the underlying core region has two potentialbottlenecks. The first is the connection between the p-contact and theunderlying electrical trace, i.e., trace 44 in FIG. 2. The second is thethermal path from trace 44 to the underlying core region 46. Except inthe case of an asymmetric conducting adhesive, the first bottleneck isnot potentially limiting because solder or direct bonding leads tometal-metal bonds having a thermal conductivity that is greater thanthat of the LED materials. The second bottleneck presents moresignificant problems because traces must be insulated from theunderlying heat-dissipating core, and the insulating layers used inprinted circuit boards also have high thermal resistance.

In one aspect of the present invention, an asymmetric conductor that hasbeen modified to provide light scattering as well as verticalconnections is utilized. The manner in which asymmetric conductorsoperate can be more easily understood with reference to FIG. 3, which isa cross-sectional view of a pair of surfaces that are bonded by anasymmetric conductor, such as an anisotropic conductive film (ACF). Theasymmetric conductor includes a plurality of elastic metal coatedspheres 53 that are suspended in a curable epoxy or other insulatingcarrier material that can be converted to a solid by a curing process.Each of the spheres is coated with a metallic layer 54 that renders thesphere a conductor. When a layer of this material is pressed between twosurfaces as shown in FIG. 3, the spheres that are trapped betweenconductors 51 and 52 are deformed as shown at 56. The deformed spheresmake electrical connections between electrodes 51 and 52. After thecarrier medium is cured, the two surfaces are left bonded to one anotherwith opposing conductors on the surfaces being electrically connected toone another. The density of the sphere is chosen to be high enough toassure that any pair of opposing conductors has one or more spherestrapped therebetween but low enough to assure that the spheres do notcontact one another in the horizontal direction and form a laterallyrunning conduction path.

Asymmetric conductors have been used for bonding arrays of LEDs tounderlying substrates having switching circuitry therein for over adecade. For example, U.S. Pat. No. 6,965,361 teaches a display in whicha layer that includes an array of organic LEDs is bonded to a substratehaving thin film transistors thereon for switching individual LEDs onand off.

FIG. 4 shows a cross-sectional view of a portion of a light sourceaccording to one embodiment of the present invention. Light source 60includes a plurality of surface mounted LEDs 61-64. The LEDs are bondedto traces on a mounting substrate 65. Exemplary traces are labeled at 66and 67. The traces are patterned from a metal layer that is deposited onan insulating substrate 68 that is bonded to a heat-dissipatingspreading layer 69. Substrate 68 will be discussed in more detail below.

The LEDs are bonded to the traces by an asymmetric adhesive layer ofasymmetric conductor material that includes two types of particlessuspended in an insulating carrier material. The first type of particleis shown at 72 and consists of a compressible polymer sphere with anouter metal coating that operates in a manner analogous to thatdescribed above with reference to spheres 53. The second class ofparticles consists of light reflecting particles 71 that scatter lightstriking the particles. In one aspect of the present invention, theseparticles are insulating particles such as TiO₂. The scatteringparticles have diameters that are significantly less than those of theconducting spheres to assure that the scattering particles do notinterfere with the compression of the spheres between the surfaces thatare to be connected electrically. For example, the scattering particlescan have diameters that are less than the minimum distances between theelectrodes of the LEDs and the corresponding traces on layer 68. Itshould be noted that the scattering particles preferably have diametersthat are greater than the wavelength of light generated by the LEDs. Inone aspect of the invention, the light scattering particles have amaximum dimension that is less than half the diameter of thecompressible spheres when the compressible spheres are not deformed bybeing sandwiched between the conductors.

In one aspect of the invention, the LEDs are pressed into a layer ofasymmetric adhesive material while the carrier material is in a liquidstate. The layer of asymmetric adhesive material has a thickness that issufficient to ensure that when all of the LEDs are pressed into thelayer, the excess material will be forced into the spaces between theLEDs to a height that ensures that the edges of the LEDs are covered byan asymmetric conductor as shown at 70 such that light leaving the sidewalls of the LEDs enters the layer of asymmetric conductor materialbetween the LEDs and is scattered by the scattering particles. Forexample, the thickness of the pre-cured asymmetric conductor medium canbe set such that the height of the asymmetric conductor medium betweenthe LEDs is sufficient to ensure that at least 50, 60, 70, 80, or 90percent of the light leaving the side surfaces of the LEDs enters theasymmetric conductor medium between the LEDs.

In one aspect of the invention, the top surface of layer 68 includesreflective regions, such as region 74, that reflect any light that isscattered downward back into an upward direction. These reflectiveregions could be separate reflective areas that are not connected toother structures or reflective extensions of the p-contacts.

The conducting spheres can also act as scattering particles provided themetallic coating is chosen from a material that provides a good mirror.In this regard, it should be noted that highly conductive metals such asgold and silver will provide a good mirror surface only if the surfaceis free of roughness. If the surface is not sufficiently smooth,particles will absorb light via the surface plasmon effect. Prior artparticles utilize gold or silver for the outer coating to maximize theconductivity of the coating, and hence do not provide optimal reflectivesurfaces. In one aspect of the present invention, the conductingparticles utilize aluminum as the outer coating to improve thereflectivity of the particles that are trapped between the LEDs.

Heat dissipation is an important issue in high-powered light sourcesbased on LEDs for a number of reasons. First, the efficiency ofconversion of electricity to light decreases at high temperatures.Second, the lifetimes of the LEDs also decrease with temperature. Third,the differences in thermal coefficient of expansion between the LEDs andthe carrier material used in the asymmetric conductor can lead tofractures in the asymmetric conductor and separation of the LEDs fromthe underlying structure. Hence, maximizing heat transfer from the LEDsto the surrounding environment is an important aspect of any high-powerLED light source design.

The heat generated by the LEDs must be transferred either to the airabove the LEDs or to heat-spreading layer 69, which is in thermalcontact with a heat-dissipating structure that couples the heat to theenvironment. To transfer the heat to layer 69, the thermal resistance oflayer 68 is preferably much less than the thermal resistance of theasymmetric conductor layer between the contacts on the LED and thecorresponding traces on layer 68. The thermal resistance of layer 68 canbe reduced by using a material that has a low thermal resistance whilestill providing electrical insulation and by increasing the surface areaof layer 68 over which heat is transferred to layer 69, and decreasingthe thickness of layer 68.

Because the thickness of the layer of asymmetric conductor between thep-contact on the LED and corresponding trace on layer 68 is very thin,the thermal resistance is determined by the area of contact between thetrace and layer 68. As noted above, it is advantageous to provide areflecting surface 74 between the LEDs. In one aspect of the presentinvention, this surface is created by extending the traces opposite thep-contacts on the LEDs, which will be referred to as the p-contacttraces. These traces can be coated with an aluminum or other highlyreflective coating. The area of the traces can be extended tosubstantially fill the regions between the LEDs thereby increasing theheat transfer area substantially. The maximum expansion of this areadepends on the spacing of the LEDs. In one aspect of the invention, theLEDs are spaced such that the area of the p-traces is at least twice thearea of the p-contact on the LEDs.

FIG. 5 is a top view of a portion of a mounting substrate before theLEDs have been bonded to the n-traces and p-traces. The expandedp-traces are shown at 81. The area in which the LEDs bond is shown inphantom at 82. The n-traces are shown at 83. The electrical connectionsto the traces on the surface of insulator 88 are made through vias thatare under the traces to conducting planes that are in layers under theheat-spreading layer.

FIG. 6 is a cross-sectional view of a portion of another embodiment of alight source according to the present invention. Light source 90 issimilar to light source 60 discussed above with reference to FIG. 4 inthat light source 90 includes a plurality of LEDs that are bonded totraces on a mounting substrate by asymmetric conductor material. Thetraces that connect the p-contacts are enlarged as discussed above withrespect to FIG. 5. A typical enlarged trace is shown at 99. The tracesare connected to a wiring layer 98 by conducting vias 97 that connecteach trace to a corresponding conductor on wiring layer 101. These viaspass through insulators in heat-spreading layer 91. Hence, the only highthermal impedance area is the area between the expanded traces on thesurface of insulator 102 and heat-spreading layer 91.

Light source 90 also includes a phosphor conversion layer 94 thatconverts a portion of the light generated by the LEDs to light having adifferent spectrum that is chosen such that the light leaving layer 94is perceived to be white light with a predetermined color temperature.The phosphor conversion layer is constructed by suspending phosphorparticles 96 in a transparent carrier medium such as an epoxy and thencuring the epoxy layer once the suspension has been spread over thelight source. Since the areas between the LEDs are filled with theasymmetric conductor material, the phosphor conversion layer can be of amore uniform thickness, and hence, color variations resulting from theblue light from the LEDs passing through different areas of phosphorwith differences in thickness of phosphor are reduced.

In one aspect of the present invention, phosphor conversion layer 94 isconstructed from the same epoxy medium as the asymmetric conductor. Inanother aspect of the invention, the phosphor conversion layer has acoefficient of thermal expansion that is substantially equal to that ofthe asymmetric conductor. Here, the two layers will be defined as havingsubstantially equal thermal coefficients of expansion if the differencein thermal coefficients of expansion is less than a difference thatwould cause the two layers to separate during the thermal cycling of thelight source over its design lifetime. This arrangement reduces theproblems associated with having different coefficients of thermalexpansion associated with different layers.

To further improve the thermal conductivity of the asymmetric conductormaterial and phosphor conversion layer, particles 95 of a high thermalconductivity medium can be included in the layers. For example,particles of diamond, crystalline silicon, or GaN can be included inlayer 94 and the asymmetric conductor material. These materials havesignificantly higher thermal conductivity than the epoxy resins used toconstruct the asymmetric conductor material and phosphor conversionlayer, and hence, their inclusion results in a layer having an averagethermal conductivity that is higher than that of the epoxy. Thesematerials are also transparent, and hence do not absorb light. The useof such materials is discussed in detail in co-pending U.S. patentapplication Ser. No. 12/845,104, filed on Jul. 28, 2010, which isincorporated herein by reference.

As noted above, heat-spreading layer 102 moves the heat generated by theLEDs to a region of the light source that has contact with theenvironment and can include structures such as the fins shown at 93 thathelp to dissipate the heat to the surroundings. Typically, the heat isdissipated to the air; however, embodiments in which the heat-spreadinglayer is in contact with other structures that dissipate the heat canalso be constructed.

In the above-discussed embodiments, the thermal resistance of layer 102presents the most challenges in terms of removing heat from the LEDs.This layer can be constructed from a thin polymeric layer or a thinlayer of an insulating material such as glass. Alternatively, layer 102can be constructed from an undoped crystalline material that is grown onheat-spreading layer 91. For example, layers of diamonds can bedeposited on a number of substrates at low temperature using chemicalvapor deposition or similar techniques. Such coatings are commonly usedas scratch resistant coatings on glass or plastics. Similarly, undopedsilicon could also be used as the insulator. These crystalline materialshave significantly higher thermal conduction than do polymeric layers.

In one aspect of the invention, the wiring layer is coupled to a drivecircuit 103 that includes a power connector 104 for providing power tothe LEDs. The drive circuit can also include switching circuitry thatdetermines the internal connection topography for the array of LEDs.

The manner in which a light source according to one embodiment of thepresent invention is constructed will now be explained with reference toFIGS. 7-9, which are cross-sectional views of a portion of a lightsource according to one embodiment of the present invention at variousstages in the fabrication process. Initially, a mounting substrate 115is covered with a layer 116 of the asymmetric conductor material in anon-cured liquid state as shown in FIG. 7. Each LED 117 is positionedsuch that the contacts on the LED are over the corresponding traces onmounting substrate 115. The positioned LEDs are then forced againstmounting substrate 115 as shown in FIG. 8. The LEDs can be forced intothe layer 116 of asymmetric conductor material one at a time or attachedto a temporary carrier and forced into the asymmetric conductorsimultaneously. After the LEDs have been forced into the layer of theasymmetric conductor material, pressure is applied to the LEDs and theasymmetric conductor material is heated to cure the material, and hencerender the asymmetric conductor layer solid. As noted above, the depthof the uncured asymmetric conductor material is set such that theasymmetric conductor fills the regions betweens the LEDs when the LEDsare forced into the asymmetric conductor material. After the asymmetricconductor material has cured, the layer 118 of phosphor-containingmaterial is deposited over the cured asymmetric conductor layer andcured as shown in FIG. 8.

The above description refers to various surfaces in terms of top orbottom surfaces. These are merely labels that express the relationshipof the surfaces as seen in the drawings when the drawings are held in aparticular orientation. These labels do not imply any relationship withrespect to orientation on the earth.

The LEDs in the above-described embodiments of the present inventionhave been described in terms of an active layer that is sandwichedbetween an n-layer and a p-layer, the various layers being grown on asubstrate. However, it is to be understood that each of the layers mayinclude a plurality of sub-layers. Similarly, the substrate may includeone or more buffer layers that are deposited prior to depositing the LEDlayers.

FIG. 10 shows a cross-sectional view of a portion of a light source 120according to another embodiment that exhibits improved light extractioncharacteristics. Light source 120 includes a surface mounted LED die 121that is mounted on the top surface 122 of a mounting substrate 123. LEDdie 121 has surface mount contact pads 124-125 on a first surface 126and emits light from a second surface 127 and from side surfaces 128.The light that is emitted from second surface 127 first travels from theactive layer through the transparent sapphire substrate. N-contact pad124 and p-contact pad 125 are electrically coupled to an n-trace 129 anda p-trace 130, respectively, that are patterned from a metal layer thatis deposited on mounting substrate 123. Mounting substrate 123 is bondedto a heat-dissipating spreading layer 131. An anisotropic conductivefilm (ACF) material 132, also called asymmetric conductor material, issandwiched between the surface mount contacts 124-125 and the connectiontraces 129-130 such that those deformable conducting particles 133 thattouch both the contacts 124-125 and traces 129-130 are deformed and forman electrical connection between the contacts and traces. Except betweenthe contacts and traces, however, the deformable conducting particles133 are suspended in a transparent carrier material and do not conductcurrent. Unlike the asymmetric conductor material of FIG. 4, asymmetricconductor material 132 includes no smaller light reflecting particlesbut only the larger deformable conducting particles 133, which arecompressible polymer spheres with a metal outer coating. In one example,asymmetric conductor material 132 is SLP-01 made by Sony Chemicals Corp.The conducting particles 133 have an epoxy center electroplated withnickel/gold and have a diameter of about 5 microns. Other conductingparticles 133 have a coating of aluminum.

The conducting particles 133 have a relatively low reflectivity of about60% compared to a reflectivity of about 95% for small spheres oftitanium dioxide. In the embodiment of FIG. 4, the light that is emittedfrom the side surfaces of the LED dies collides not only with thesmaller light reflecting particles 71 but also with the largerdeformable conducting particles 72. Consequently, about 40% of the lightthat collides with the larger conducting particles 72 is absorbed and isnot reflected up and out of the light source 60. More light can beextracted from light source 120 by removing the larger conductingparticles 72 from the transparent carrier material that is placedadjacent to the side surfaces 128. In one example, the transparentcarrier material in asymmetric conductor material 132 is an epoxy.

In the embodiment of FIG. 10, only a thin layer 134 of asymmetricconductor material 132 is deposited over top surface 122 of mountingsubstrate 123. Layer 134 is sufficiently thick to electrically andmechanically connect LED die 121 to mounting substrate 123 but not sothick that asymmetric conductor material 132 covers the side surfaces128 of LED die 121. After LED die 121 has been mounted onto mountingsubstrate 123 by pressing the surface mount contacts 124-125 into theconnection traces 129-130 such that some conducting particles 133 touchboth the contacts 124-125 and the traces 129-130 and are deformed andform an electrical connection between the contacts and traces,asymmetric conductor material 132 is cured by heating. Then adiffusively reflective material 135 is dispensed over layer 134 adjacentto side surface 128 and between LED die 121 and the next LED die 136.The diffusively reflective material 135 includes light scatteringparticles 137 suspended in a transparent carrier material. In oneexample, the transparent carrier material in reflective material 135 issilicone, and the light scattering particles 137 are spheres of titaniumdioxide (TiO₂) with a diameter of about two microns. For comparison, thedeformable conducting particles 133 have a diameter of about fivemicrons when they are not deformed. In this example, the lightscattering particles 137 have a reflectivity of more than 95%.

After the diffusively reflective material 135 is dispersed over thecured asymmetric conductor material 132, the reflective material 135 isalso cured by heating. Then a thin layer 138 of silicone is spread overthe top of the LED dies 121, 136 and the diffusively reflective material135. Before silicone layer 138 is cured, and optics layer 139 of curedsilicone is placed over silicone layer 138. Silicone layer 138 acts asan adhesive and attaches optics layer 139 over the top of the LED dies121, 136 and the diffusively reflective material 135. Silicone layer 138is then cured by heating. Optics layer 139 has preformed lenses moldedfrom silicone that contains phosphor particles 140. Alternatively, alayer of phosphor particles 140 can be deposited onto the bottom surfaceof optics layer 139 before optics layer 139 is attached over siliconelayer 138. In this case, optics layer 139 would have no phosphorparticles dispersed throughout the silicone.

The light extraction characteristics of light source 120 are improvedbecause light leaving the side surfaces 128 of LED die 121 entersdiffusively reflective material 135 and is scattered by the scatteringparticles 137 without first being absorbed by any conducting particles133 in material 135. A higher percentage of the blue light emittedsideways from LED die 121 is eventually reflected upwards and out oflight source 120 or collides with phosphor particles 140 in optics layer139 and is converted to light in the yellow region of the opticalspectrum. In addition, the portion of yellow light that is emitted bythe phosphor particles 140 in a downwardly direction is not absorbed byany conducting particles 133 in material 135. The yellow light that isemitted downwardly is more likely to be reflected by the lightscattering particles 137 back up through optics layer 139 than ifdiffusively reflective material 135 contained conducting particles 133.

Some of the light leaving the side surfaces 128 is reflected downwardsby the scattering particles 137 and enters layer 134 of asymmetricconductor material 132. Only about 60% of the light that collides withthe deformable conducting particles 133 is reflected. In an alternateembodiment, the scattering particles 137 are added to asymmetricconductor material 132 to improve the reflectivity of layer 134. Inaddition, a reflective coating or trace is deposited on top surface 122of mounting substrate 123 between LED dies 121 and 136. The reflectivecoating beneath layer 134 and the scattering particles 137 added tolayer 134 increase the amount of light that is reflected back upwardstowards optics layer 139. In yet another alternate embodiment, thediffusively reflective material 135 is replaced with phosphor particlesdispersed in a transparent carrier material, such as silicone or epoxy.Instead of reflecting the blue light emitted from the LED dies, thephosphor particles absorb the blue light and isotropically emityellowish light. The yellowish light that is emitted downwards isreflected back up by a reflective coating on top surface 122 of mountingsubstrate 123 between the LED dies.

FIG. 11 shows another embodiment of a light source 141 that can beinexpensively produced and is suitable for use in strip lighting. Forexample, light source 141 can be manufactured as a strip of LED dies inthe linear format of a T8 fluorescent lamp that is installed in atroffer. A 1-by-x strip of LED dies are placed on a flexible plasticsubstrate 142 having the electrical topology for mounting the LED dies.Flexible plastic substrate 142 is made from a polymer, such aspolyimide, polyethylene terephthalate (PET), polyethylene naphthalate(PEN) or liquid crystal polymer (LCP). Flexible plastic substrate 142has a peel-off adhesive backing 143 that can be used to attach a stripof light source 141 to the inside of a troffer. The metal frame of thetroffer then acts as a heat sink. In one example, square dies that areabout 0.5 mm on a side are placed about 10 mm apart on flexible plasticsubstrate 142. (FIG. 11 is not drawn to scale.) Because plasticsubstrate 142 is flexible, the LED dies 121, 136 can be picked andplaced onto flexible plastic substrate 142 in a reel-to-reel process.Even when flexible plastic substrate 142 is wound on a reel, however,the portion of top surface 122 below the 0.5 millimeter length of LEDdie 121 remains substantially flat.

Instead of placing the dies on a layer 134 of asymmetric conductormaterial 132, as done for light source 120, the dies of light source 141are placed on only a small amount of asymmetric conductor material 132.Just enough asymmetric conductor material is dispensed to form anelectrical and mechanical connection between LED die 121 and substrate142 without seeping out significantly beyond the lateral boundary 143 ofLED die 121 when the die is pressed into the substrate to deform theconducting particles 133. Diffusively reflective material 135 is thendispensed over top surface 122 of substrate 142 between the dies.Because asymmetric conductor material 132 is present between the diesand substrate 142, the diffusively reflective material 135 remainsoutside the lateral boundary 144 of LED die 121.

In one embodiment, asymmetric conductor material 132 and diffusivelyreflective material 135 are cured in a single heating step. The carriermaterial should be the same for both asymmetric conductor material 132and reflective material 135 if a single curing step is used. In thiscase, the transparent carrier material in asymmetric conductor material132 is silicone as opposed to epoxy. Uncured silicone should not beplaced in contact with uncured epoxy because the epoxy will react withthe palladium catalyst in the silicone and degrade the silicone. Severalsmall drops of asymmetric conductor material 132 are first dispensedonto the traces on top surface 122 of flexible substrate 142. LED dies121 and 136 are then placed over the appropriate traces. Beforeasymmetric conductor material 132 is cured, diffusively reflectivematerial 135 is dispensed onto top surface 122 between LED die 121 andLED die 136. Sufficient reflective material 135 is dispensed to coverthe side surfaces 128 of LED dies 121 and 136. Then LED dies 121 and 136are pressed into asymmetric conductor material 132 such that theconducting particles 133 deform between the contacts on the dies and thetraces on substrate 142. While the dies are being pressed down ontosubstrate 142, asymmetric conductor material 132 and diffusivelyreflective material 135 are cured together.

Then thin layer 138 of silicone is spread over diffusively reflectivematerial 135 and the tops of the LED dies 121, 136. Thin layer 138 actsas an adhesive to bond optics layer 139 over the LED dies. A layer ofphosphor particles 140 is sprayed over the bottom surface of opticslayer 139 before optics layer 139 is attached to silicone layer 138. Inthis low-cost light source 141, optics layer 139 has no phosphorparticles dispersed in the cured silicone that forms the lenslets.Before silicone layer 138 is cured, and optics layer 139 is placed oversilicone layer 138. Optics layer 139 is rolled over the top of layer 138in a reel-to-reel process. Silicone layer 138 is then cured by heating.

FIG. 12 is a flowchart illustrating steps 145-152 of a reel-to-reelprocess by which light source 141 of FIG. 11 is manufactured. The stepsof the method of FIG. 12 are illustrated in FIGS. 13 and 14.

In a first step 145, flexible plastic substrate 142 is unrolled using areel-to-reel machine before asymmetric conductor material 132 isdeposited onto the substrate.

In step 146, a small amount of asymmetric conductor material 132 isdeposited on a mounting substrate. Step 146 is illustrated by FIG. 14A.The mounting substrate is flexible plastic substrate 142 that wasunrolled from a reel of flexible substrate in step 145. The asymmetricconductor material 132 includes deformable conducting particles 133suspended in a transparent carrier material. Although FIG. 14A shows asingle drop of asymmetric conductor material 132 being dispensed ontosubstrate 142, several smaller dots are deposited in the actualmanufacturing process. The asymmetric conductor material 132 isdeposited over the traces 129-130 on top surface 122 of substrate 142 onwhich an LED die will be placed.

In step 147, LED die 121 is mounted onto substrate 142 in a flip-chipmanner over the deposited amount of asymmetric conductor material 132.Step 147 is illustrated by FIG. 14B.

In step 148, diffusively reflective material 135 is dispensed onto themounting substrate adjacent to the mounted LED dies such that reflectivematerial 135 contacts the side surfaces 128 of the LED dies. Diffusivelyreflective material 135 includes light scattering particles 137suspended in the transparent carrier material. The carrier materials ofthe asymmetric conductor material 132 and the reflective material 135are the same. In this case, both carrier materials are silicone. Inanother embodiment, epoxy is the carrier material in both asymmetricconductor material 132 and reflective material 135. Because the carriermaterials are the same, asymmetric conductor material 132 need not becured before reflective material 135 is dispensed adjacent to the diesand contacting the uncured asymmetric conductor material 132. Step 148is illustrated by FIG. 14C.

In step 149, LED die 121 is pressed against mounting substrate 142 suchthat some of the deformable conducting particles 133 deform and form anelectrical connection between the contact pads on LED die 121 and thetraces on substrate 142. Step 149 is illustrated by FIG. 14D.

In step 150, the transparent carrier material of both the asymmetricconductor material and the diffusively reflective material is heatedsuch that both asymmetric conductor material 132 and reflective material135 cure to a hardened state. In one embodiment of the manufacturingmethod of FIG. 12, the curing step 150 and the pressing step 149 areperformed concurrently. Step 150 is performed in two substeps. In thefirst substep, asymmetric conductor material 132 and reflective material135 are pre-heated to about 80 degrees Celsius for about two minutes.Then in step 149, LED die 121 is pressed down with two bumps, eachhaving a force of about 0.4 Neutons. So the LED dies are pressed with atotal force of 0.8 Neutons to deform the conducting particles 133. Whilethe LED dies are being pressed down onto substrate 142, the secondcuring substep is performed. While the LED dies are being pressed,asymmetric conductor material 132 and reflective material 135 are heatedto about 230 degrees Celsius for about thirty seconds to complete thecuring.

In step 151, thin layer 138 of transparent carrier material is spreadover the top of the LED dies 121, 136 and the cured diffusivelyreflective material 135. Layer 138 is not cured in step 151. Step 151 isillustrated by FIG. 14E.

In step 152, a layer of cured transparent carrier material is depositedover the thin layer 138 of uncured transparent carrier material. Layer138 acts as an adhesive and attaches the layer of cured transparentcarrier material to the top of the LED dies 121, 136 and the diffusivelyreflective material 135. The entire light source 141 is then heated, andthe thin layer 138 of carrier material cures. In one embodiment, thelayer of cured transparent carrier material is optics layer 139 in whichlenslets have previously been formed using a molding process. Phosphorparticles 140 suspended in the cured transparent carrier material andconvert the blue light emitted from LED die 121 into yellowish light.Optics layer 139 is unrolled from a reel using a reel-to-reel machine.Step 152 is illustrated by FIG. 14F.

In another embodiment, a layer of phosphor particles 140 is dusted ontothe bottom surface of the layer of cured transparent carrier material139 as shown in FIG. 13. The phosphor particles are then embedded intothe uncured transparent carrier material 138 before the layer 138 isheated. Applying a layer of phosphor particles 140 to the underside ofoptics layer 139 can be less expensive than molding optics layer 139using a carrier material in which phosphor particles are disbursed.

The string of LED dies with lenslets of light source 141 can then berolled up onto a reel. The reel of light source 141 can easily betransported to the installation site, such as a commercial building. Forexample, at the installation site, a strip of light source 141 can becut from the reel at a length corresponding to a T8 fluorescent bulb.The protective paper can then be peeled from adhesive backing 143 on theunderside of flexible plastic substrate 142 of light source 141, and thestrip of light source 141 can be taped to the frame of a troffer. Tracesthat extend from upper surface 122 of flexible plastic substrate 142 arethen connected to the power lines of the troffer.

The method of manufacturing light source 141 shown in FIG. 12 reducesthe number of required curing steps and the number of components inorder to achieve a low cost process for making distributed lighting.Modifications of the method of FIG. 12 can improve the durability andthe light extraction of the produced light sources at the expense ofadded steps and components. FIGS. 15A-D are flowcharts illustratingother methods of making light sources that use diffusively reflectivematerial instead of reflective cups to reflect light that is emittedsideways from the LED dies.

FIG. 15A shows the steps 153-161 of a first alternate method ofmanufacturing a strip light source in which epoxy is the transparentcarrier material in both asymmetric conductor material 132 andreflective material 135. LED dies are flip-chip mounted over anepoxy-based asymmetric conductor material that has been dispensed on amounting substrate. The epoxy-based diffusively reflective materialcontaining TiO₂ spheres is dispensed on the mounting substrate betweenthe LED dies. The carrier material is pre-cure for two minutes at 80degrees Celsius, which starts the chemical reaction of the curingprocess. Then “tonnage” (a metal block) is applied to press the LED diesdown onto the substrate and thereby deform those conducting particlesthat happen to be positioned between the contacts on the LED dies andthe corresponding traces on the substrate. While the LED dies are beingpressed down, the carrier material is heated to 230 degrees Celsius forthirty seconds. Then a thin layer of silicone is applied as glue overthe top of the LED dies and the cured reflective material. A lens stripmolded from silicone is placed over the thin layer of silicone, and thesilicone layer is cured. The epoxy-based carrier material of the lightsource produced with the method of FIG. 15A will likely degrade fasterthan silicone-based carrier material in the presence of the heatgenerated by the LED dies.

FIG. 15B shows the steps 162-171 of a second alternate method ofmanufacturing a strip light source in which epoxy is the transparentcarrier material for asymmetric conductor material 132, but silicone isthe transparent carrier material for reflective material 135. Becauseuncured silicone should not be placed in contact with uncured epoxy, themethod of FIG. 15B includes an additional curing step for the epoxybefore the silicone-based reflective material is dispensed between theLED dies.

FIG. 15C shows the steps 172-179 of a third alternate method ofmanufacturing a strip light source in which the uncured reflectivematerial is used as a glue to attach the lens strip.

FIG. 15D shows the steps 180-187 of a fourth alternate method ofmanufacturing a strip light source in which a single high-temperaturecure step is used to cure the asymmetric conductor material, thediffusively reflective material and the thin silicone layer under thelens strip. In the method of FIG. 15D, silicone is used as the carriermaterial for all of the asymmetric conductor material, the reflectivematerial, the thin layer that attaches the lens strip and the moldedlens strip itself. Alternatively, epoxy can be used as the carriermaterial for each of these materials and layers. Thus, the lens stripthat includes phosphor particles would be constructed from the sameepoxy medium as the asymmetric conductor material.

FIG. 16 shows a light source 190 in which diffusively reflectivematerial 135 reflects light emitted from the side surfaces 128 of LEDdie 121 in order to achieve greater light extraction without using areflective cup. Much of the light emitted from LED die 121, however,still does not escape light source 190 because it is reflected back fromthe surface of the conventional lens 191 and is absorbed by LED die 121.Most of the light emitted by LED die 121 exits through the upper surfaceas opposed to the side surfaces. The conventional form of lens 191maximizes the area of the lens surface that is at a right angle to thelocation from which the most light is being emitted because light isless likely to be reflected if it strikes the lens surface closer to aright (normal) angle. So the lens is designed so that the first ordereffect of reflection at the lens surface is minimized.

Where much of the light does not exit the lens on the first pass,however, the second order effects of whether the reflected light isabsorbed should be given a larger influence over the shape of the lens.About 45% of the exiting light that strikes the silicone/air interfaceof lens 191 at a normal angle is reflected because the index ofrefraction of the silicone is about 1.41 (the index changes withtemperature) and the index of refraction of air is about 1.00. The uppersurface of LED die 121 is assumed to act as a Lambertian emitter inwhich the intensity of the emitted light is at a maximum normal to theupper surface and decreases in proportion to the cosine of the angleaway from normal. Thus, because the upper surface of LED die 121 is nota point light source, a majority of the light does not strike thesilicone/air interface of lens 191 exactly at a normal angle, and amajority of the light emitted by LED die 121 is reflected back. Theconventional form of lens 191 reflects light approximately back to itssource. Because the upper surface of LED die 121 has a reflectivity ofabout 50% as opposed to the 95% reflectivity of reflective material 135,the conventional form of lens 191 shown in FIG. 16 does not maximize thelight extraction characteristics of light source 190, which has a thicklayer of reflective material 135 adjacent to LED die 121.

FIG. 17A shows a strip light source 192 with reflective material 135adjacent to LED die 121 and a novel lens 193 having a dimple above thedie. More light is able to exit light source 192 than light source 190because the light that does not exit lens 193 on the first pass is morelikely to be reflected back to the 95% reflective material 135 insteadof to the 50% reflective upper surface of LED die 121. Emitted lightthat is reflected back off the surface of lens 193 is directed away fromthe light's source on the LED die and towards the area adjacent to thedie. In addition, light 194 that exits the side surfaces 128 of LED die121, is reflected up by material 135, and then is reflected back down atthe silicone/air interface of lens 193 is more likely to strikereflective material 135 than LED die 121. Dimple shaped lens 193improves the light extraction characteristics of light sources withlarge second order effects of light being reflected back off the lenssurface where the LED die has a much lower reflectivity than thematerial surrounding the die.

FIG. 17B shows structures on the surface of lens 193 that improve lightextraction. Although the largest plurality of light originates from thecenter of the upper surface of LED die 121, the light that strikes lens193 originates from multiple locations, including the many phosphorparticles 140, the many light scattering particles 137 and manylocations over the upper surface of LED die 121. Thus, light strikeseach location of lens 193 from many different angles. The light thatstrikes a structured surface of lens 193 instead of a smooth surface ismore likely to exit lens 193 by finding a normal angle that exhibits alower total internal reflection (TIR). FIG. 17B shows three types ofstructured surfaces of lens 193 that improve light extraction. Thesurface of lens 193 can have a small sinusoidal wave structure 195, a“rectified” wave structure 196 or a saw-tooth structure 197. In theactual implementation, one micro-structure covers the entire surface oflens 193. Each of these micro-structures can be two-dimensional orthree-dimensional. For example, ridges of the two-dimensional saw-toothstructure 197 can extend laterally across the light source strip. Or athree-dimensional saw-tooth micro-structure 197 would result in pyramidsacross the surface of lens 193. The three-dimensional “rectified” wavestructure 196 would result in small hemispheres across the surface oflens 193.

FIG. 18 is a perspective view of strip light source 192 withdimple-shaped lenses 193. When light source 192 is attached to theinside surface of a troffer, optics layer 139 and reflective material135 is peeled back to expose (at 198) the power and ground traces on theflexible plastic substrate 142. The power and ground traces are thenattached to the power and ground wires of the troffer.

Although certain specific embodiments are described above forinstructional purposes, the teachings of this patent document havegeneral applicability and are not limited to the specific embodimentsdescribed above. Accordingly, various modifications, adaptations, andcombinations of various features of the described embodiments can bepracticed without departing from the scope of the invention as set forthin the claims.

What is claimed is:
 1. A method comprising: depositing an amount ofasymmetric conductor material on a mounting substrate, wherein theasymmetric conductor material comprises deformable conducting particlessuspended in a transparent carrier material; mounting a light emittingdiode (LED) die onto the mounting substrate in a flip-chip manner overthe deposited amount of asymmetric conductor material; dispensing adiffusively reflective material onto the mounting substrate adjacent tothe mounted LED die such that the diffusively reflective materialcontacts the LED die, wherein the diffusively reflective materialcomprises light scattering particles suspended in the transparentcarrier material; pressing the LED die against the mounting substratesuch that some of the deformable conducting particles deform afterdispensing the diffusively reflective material; and heating thetransparent carrier material such that both the asymmetric conductormaterial and the diffusively reflective material cure to a hardenedstate.
 2. The method of claim 1, wherein the asymmetric conductormaterial is not fully cured before the heating of the transparentcarrier material.
 3. The method of claim 1, wherein the mountingsubstrate is a flexible plastic substrate.
 4. The method of claim 1,further comprising: unrolling the mounting substrate using areel-to-reel machine before the depositing the amount of asymmetricconductor material.
 5. The method of claim 1, wherein the transparentcarrier material is silicone.
 6. The method of claim 1, furthercomprising: depositing a layer of cured transparent carrier materialover the LED die and the diffusively reflective material, wherein thelayer comprises phosphor particles suspended in the cured transparentcarrier material.
 7. The method of claim 1, further comprising:depositing phosphor particles over the LED die and the diffusivelyreflective material.
 8. The method of claim 1, wherein the LED die hassurface mount contacts that include a p-contact and an n-contact,wherein connection traces are disposed on a top surface of the mountingsubstrate, wherein the connection traces include an n-trace and ap-trace, and wherein the pressing of the LED die against the mountingsubstrate causes a first plurality of the deformable conductingparticles to deform between the n-trace and the n-contact and a secondplurality of the deformable conducting particles to deform between thep-trace and the p-contact.
 9. The method of claim 8, wherein the n-traceis electrically coupled to the n-contact through the deformableconducting particles.
 10. The method of claim 1, wherein the diffusivelyreflective material contacts a side surface of the LED die but does notcontact a top surface of the LED die or a bottom surface of the LED die.11. The method of claim 1, wherein the light scattering particles arespheres of titanium dioxide.
 12. The method of claim 1, furthercomprising: placing an optics layer over the diffusively reflectivematerial and the LED die, wherein the optics layer includes adimple-shaped lens centered over the LED die.
 13. The method of claim 1,wherein the deformable conducting particles have an average firstdiameter when the deformable conducting particles are not deformed,wherein the light scattering particles have an average second diameter,and wherein the average first diameter is greater than the averagesecond diameter.
 14. A method comprising: dispensing an amount ofasymmetric conductor material on a mounting substrate, wherein theasymmetric conductor material comprises deformable conducting particlessuspended in an epoxy-based carrier material; mounting a light emittingdiode (LED) die onto the mounting substrate in a flip-chip manner overthe dispensed amount of asymmetric conductor material; pressing the LEDdie against the mounting substrate such that some of the deformableconducting particles deform; heating the epoxy-based carrier materialwhile pressing the LED die against the mounting substrate; dispensing adiffusively reflective material onto the mounting substrate adjacent tothe mounted LED die such that the diffusively reflective materialcontacts a side surface of the LED die but does not contact a topsurface of the LED die, wherein the diffusively reflective materialcomprises light scattering particles suspended in a silicon-basedcarrier material; and heating the silicon-based carrier material suchthat the diffusively reflective material cures to a hardened state. 15.The method of claim 14, further comprising: dispensing a layer ofsilicone over the LED die and the diffusively reflective material;placing a lens strip over the layer of silicone; and heating the layerof silicone to attach the lens strip over the LED die.
 16. The method ofclaim 15, wherein the layer of silicone includes phosphor particlessuspended in the silicone.
 17. The method of claim 15, wherein the lensstrip includes a dimple-shaped lens centered over the LED die.
 18. Themethod of claim 14, wherein the epoxy-based carrier material is notfully cured before the heating of the silicon-based carrier material.19. The method of claim 14, further comprising: unrolling the mountingsubstrate using a reel-to-reel machine before the dispensing of theamount of asymmetric conductor material.
 20. The method of claim 14,further comprising: depositing a layer of cured transparent carriermaterial over the LED die and the diffusively reflective material,wherein the layer comprises phosphor particles suspended in the curedtransparent carrier material.